IC CARD MODULE

An IC card mooule includes a substrate 12 one side of which is provided with a connection terminal 7; and a resin-sealed semiconductor IC 11 which has been previously sealed by a resin. This connection terminal and the resin sealed semiconductor IC are electrically connected to each other and are mo...

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Bibliographische Detailangaben
Hauptverfasser:	BABA, FUMIAKI, OCHI, KATSUNORI, KODAI, SYOJIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BOOK COVERS BOOKBINDING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILES HANDLING RECORD CARRIERS LOOSE LEAVES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED CIRCUITS PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES SPECIAL PRINTED MATTER TRANSPORTING
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Beschreibung
Zusammenfassung:	An IC card mooule includes a substrate 12 one side of which is provided with a connection terminal 7; and a resin-sealed semiconductor IC 11 which has been previously sealed by a resin. This connection terminal and the resin sealed semiconductor IC are electrically connected to each other and are molded with a molding resin 17 in such a manner that they are covered with the molding resin so as to prevent at least the electrically-connected portion 16 between them from being allowed to appear. Accordingly, reliable modules can be efficiently manufactured, and such reliable modules can be readily mounted on IC card substrates.