System for enhancing current carrying capacity of printed wiring board

The disclosure relates to a printed wiring board system including a printed wiring board having an electrical conductor on one surface thereof, a pair of apertures extending through the printed wiring board, an electrically conductive jumper extending through each the aperture and beyond the surfaces of the printed wiring board surrounding the apertures, the portions of the jumpers extending beyond the electrical conductor carrying surface being positioned along the surface of the board and substantially parallel thereto, solder being disposed over each of the portions of the jumpers extending beyond the conductor carrying surface, the solder extending over the entire region between the portions. The additional solder build up between and around the jumpers substantially increase the current carrying capacity of the jumper and metal trace combination.