Solder paste for use in a reducing atmosphere

A solder paste for use in a reducing atmosphere is disclosed. The solder paste includes a solder powder and an alcohol binder. The reducing atmosphere serves as a flux, thereby eliminating flux residues and the problems associated therewith. Solder splattering is reduced by using a polyhydric alcoho...

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Bibliographische Detailangaben
Hauptverfasser:	SISSENSTEIN, DAVID W., JR, EMERICK, ALAN J, SARAIYA, MUKUND K, ELMGREN, PETER J, RIVENBURGH, DENNIS L., SR
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A solder paste for use in a reducing atmosphere is disclosed. The solder paste includes a solder powder and an alcohol binder. The reducing atmosphere serves as a flux, thereby eliminating flux residues and the problems associated therewith. Solder splattering is reduced by using a polyhydric alcoholic binder which vaporizes or decomposes before the solder liquifies during heating. The use of such a solder paste in a reducing atmosphere results in no hazardous chemical by-products and, because the solder is handled in the form of a paste, is compatible with electrical components requiring precise dimensional tolerances.