MULTILAYER COMPOSITE MOLD STRUCTURE FOR MOLDING ON HOT SURFACES
A mold structure comprising layers with different physical properties is used to provide hot surface during molding. The use of a thin layer of low thermal conductivity (15) covered by a smooth skin layer (17) prevents quick cooling of the surface of the preheated plastic to be molded. The plastic s...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A mold structure comprising layers with different physical properties is used to provide hot surface during molding. The use of a thin layer of low thermal conductivity (15) covered by a smooth skin layer (17) prevents quick cooling of the surface of the preheated plastic to be molded. The plastic surface remains molten and flow to fill the mold during press closing, resulting in smooth surfaces even when fiber reinforced plastics are used. |
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