CHIP-TYPE ELECTRIC COMPONENT AND METHOD FOR ITS PRODUCTION

The component is provided with an insulating sleeve (1) which consists of a dielectric material frame (2) surrounding a cut-out (3), cured cast resin (5) and plastic films (6), which seal the cut-out (3) externally; openings (8) are provided at mutually opposite points and external terminal elements (9) are provided, consisting of metal layers (11) which are in each case located on the plastic film (6), on the inner walls (12) of the openings (8) and on surface parts (13) of the frame (2), which are adjacent at right angles, where they are separated from one another by an insulating spacing (14). The method provides for the electrical components to be housed in cut-outs in a dielectric material plate, to be cast in place there with curable cast resin, the openings (8) furthermore to be fitted and the metal layers (11) to be applied, after which, the plate pretreated in this manner is divided into individual pieces.