RADIATION CROSS-LINKABLE POLYMER SYSTEM FOR APPLICATION AS PHOTORESIST AND DIELECTRIC FOR MICRO WIRING
To shorten the exposure time, a negative photoresist is provided which is suitable for leaving on a microelectronic device as dielectric because of its thermal and mechanical properties and which consists of 90 to 100% of a polyether polyacrylate having acrylic acid terminal groups and of up to 10%...
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