Solder pads for use on printed circuit boards

Alignment of leaded surface mount components to solder pads is enhanced by providing at least two soldered areas (12, 14) per lead, separated by a space of non-wettable material (16) so that during component placement on the soldered areas there is a tendency for the components to self centre as the...

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Bibliographische Detailangaben
Hauptverfasser:	ROCHE, KEVIN JOSEPH, NAPP, DUANE THEODOR
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Alignment of leaded surface mount components to solder pads is enhanced by providing at least two soldered areas (12, 14) per lead, separated by a space of non-wettable material (16) so that during component placement on the soldered areas there is a tendency for the components to self centre as the leads fall between the raised soldered areas where they are retained during a reflow operation.