THERMAL CONDUCTION DEVICE
The present invention relates to a thermal conduction device well suited to cool electronic components such as semiconductor devices, in which a porous layer (11) is provided at the surface part of the contact interface of a heat generating element (1) or a heat sink element (2), and a liquid (13) s...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention relates to a thermal conduction device well suited to cool electronic components such as semiconductor devices, in which a porous layer (11) is provided at the surface part of the contact interface of a heat generating element (1) or a heat sink element (2), and a liquid (13) such as oil is contained in cavities (15) formed in the porous layer (11), the heat generating element (1) and the heat sink element (2) being held in close contact by the surface tension of the liquid (13), whereby heat generated by the heat generating element (1) is transferred to the heat sink element (2). |
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