POLYIMIDES AND HEAT-RESISTANT ADHESIVES COMPRISING THE SAME

Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; (where Y is a radical selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropyl...

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Bibliographische Detailangaben
Hauptverfasser:	SONOBE, YOSHIHO 2070, IIJIMAO, OIKAWA, HIDEAKI 2070, IIJIMAO, YAMAGUCHI, AKIHIRO 1-13-24, TAMAI, SHOJI 2070, IIJIMAO, OHTA, MASAHIRO 1541, YABEO, OHKOSHI, KOUJI 4-10-8, KAWASHIMA, SABURO 4-37-14, OYABE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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