Soldering device

A device for removing soldered components (l) from a pcb (2) has a vacuum pick-up system consisting of two concentric tubes (6,8), the outer tube (8) is free sliding and rests on top of the component (l) and, when a vacuum is applied, exerts a force on it. Hot gas is blown down a duct (l0) surroundi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TODD, RICHARD IAN, CLAYDON, ROBERT CHARLES
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A device for removing soldered components (l) from a pcb (2) has a vacuum pick-up system consisting of two concentric tubes (6,8), the outer tube (8) is free sliding and rests on top of the component (l) and, when a vacuum is applied, exerts a force on it. Hot gas is blown down a duct (l0) surrounding the pick-up system into a hood (7,l8) surrounding the component (l) and when this gas melts the solder (5) the pick-up system lifts it clear of the pcb (2) automatically.