Surface mount technology automated repair system

In equipment for assembling a plurality of electronic components (42) on a circuit board (50 including means (26A,26B,28,30) for manipulating the components relative to the board, and processor means for controlling the manipulating means in a predetermined sequence to effect assembly of the compone...

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Bibliographische Detailangaben
1. Verfasser:	KOLESAR, MICHAEL J
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	In equipment for assembling a plurality of electronic components (42) on a circuit board (50 including means (26A,26B,28,30) for manipulating the components relative to the board, and processor means for controlling the manipulating means in a predetermined sequence to effect assembly of the components on the board, repair apparatus for removing faulty components from boards after assembly comprising: a source of heat; means (72) for applying heat from said heat source to a faulty component to be removed from a board, said heat applying means being carried by and movable with the component manipulating means (26A,26B,28,30), and means for enabling the processor means selectively to activate said heat source, said heat applying means and the component manipulating means in a predetermined repair sequence to remove said faulty component from said board.