Heat activatable adhesive for wire scribed circuits

A non-blocking, solid, adhesive composition which can be activated upon application of sufficient heat or ultra­sonic energy without becoming C-staged, comprising (a) a first component having an epoxide-, hydroxy- or unsaturated functionality grater than 2, said polymeric resin being selected from the group consisting of polyesters, poly­urethanes and epoxies; (b) a second component comprised of at least one filler, or at least one polyfunctional compound containing a polyaromatic backbone and having an average molecular weight below about 7000, or mixtures thereof, the weight ratio of said first component so said second com­ponent being between about 1.5 : 1 and about 9 : 1; and (c) a curing agent which is capable of reacting or initi­ating a reactio n with the functional groups of the poly­meric resin to form crosslinks and cure the polymeric resin to a C-stage upon application of sufficient energy in the form of heat or radiant energy, said curing agent being non-reactive or blocked at the condition which will acti­vate the adhesive composition, said curing agent being pre­sent in an amount sufficient to C-stage the polymeric resin. The adhesive composition is flexible, and in the C-stage, is capable of forming an infusible composition which does not melt, flow or decompose when exposed for 10 seconds to molten solder at 260°C and does not soften when exposed for 1 minute to dichloromethane at 25°C. The adhesive composi­tion is suitable for bonding wire to a surface, to another wire or to itself.