Bond wire transmission line

@ A bond wire connection between two semiconductor devices alleviates the problem of inductive loading at high frequencies by providing a capacitive effect which compensates for inductive reactance. The capacitive effect is provided by utilizing multiple parallel layers of bond wires at a common ele...

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Bibliographische Detailangaben
Hauptverfasser:	GRELLMAN, ERWIN H, ROLAND, LEONARD A
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE SEMICONDUCTOR DEVICES WAVEGUIDES
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Beschreibung
Zusammenfassung:	@ A bond wire connection between two semiconductor devices alleviates the problem of inductive loading at high frequencies by providing a capacitive effect which compensates for inductive reactance. The capacitive effect is provided by utilizing multiple parallel layers of bond wires at a common electrical connection point. As more layers are added the net impedance can be controlled so as to match the impedance driving the downstream semiconductor.