Copper alloys having an improved combination of strength and conductivity
A copper base alloy having an improved combination of conductivity and strength for applications such as lead frames or electrical connectors. The alloys consists essentially of from about 0.3 to 1.6% by weight iron, with up to one-half the iron content being replaced by nickel, manganese, cobalt, a...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng ; fre ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A copper base alloy having an improved combination of conductivity and strength for applications such as lead frames or electrical connectors. The alloys consists essentially of from about 0.3 to 1.6% by weight iron, with up to one-half the iron content being replaced by nickel, manganese, cobalt, and mixtures thereof; from about 0.01 to about 0.20% by weight magnesium; from about 0.10 to about 0.40% by weight phosphorus; up to about 0.5% by weight tin or antimony and mixtures thereof; and the balance copper. The phosphorus to magnesium ratio and phosphorus to the total content of phosphide formers ratio are maintained within critical limits. |
---|