PROCESS FOR DEPOSITING METALS ON SEMICONDUCTING POWDERS

Gold, silver or palladium can be deposited by photoredox reaction on semiconductor oxide powders by irradiating a suspension of semiconductor oxide powder in the presence of oxygen, CO2 or mixtures thereof, of an oxidizable system which protects the semiconductor from photocorrosion, and of a salt o...

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Bibliographische Detailangaben
Hauptverfasser:	BUHLER, NIKLAUS, MEIER, KURT, REBER, JEAN-FRANCOIS
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PRETREATMENT OF RAW MATERIALS PRODUCTION AND REFINING OF METALS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	Gold, silver or palladium can be deposited by photoredox reaction on semiconductor oxide powders by irradiating a suspension of semiconductor oxide powder in the presence of oxygen, CO2 or mixtures thereof, of an oxidizable system which protects the semiconductor from photocorrosion, and of a salt or complex of copper, lead, mercury, tin, gold, silver or palladium.