AUTOMATIC WAVE SOLDERING MACHINE

A solder pot (16,80) for applying solder to exposed metallic surfaces in the undersides of circuit boards (78) carried by a conveyor (18) up a sloping path, the solder pot (16,80) being pivotally mounted to a post (88) and having jacking means (92) connected to the bottom of the solder pot, whereby...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BUSZARD, JOHN F, DROUIN, MARCEL, RUDZICZ, MATTHEW J, DOWN, WILLIAM H, WOODGATE, RALPH W, RAHN, ARMIN, MAKHOUL, ELIE
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A solder pot (16,80) for applying solder to exposed metallic surfaces in the undersides of circuit boards (78) carried by a conveyor (18) up a sloping path, the solder pot (16,80) being pivotally mounted to a post (88) and having jacking means (92) connected to the bottom of the solder pot, whereby the solder pot (16,80) may be raised or lowered as desired, and, in the lowered position, may be swung out from below the conveyer (18) for maintenance.