EPOXY RESIN SYSTEMS MODIFIED WITH THERMOPLASTIC RESINS

1. A composition containing (a) an epoxy resin having more than one epoxy group, and (b) a polyimide consisting essentially of the recurring unit of the formula see diagramm : EP0099338,P15,F1 wherein the four carbonyl groups are attached directly to different carbon atoms, the carbonyl groups being...

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Bibliographische Detailangaben
Hauptverfasser: KING, JOHN J, SELLERS, RALPH F
Format: Patent
Sprache:eng ; ger
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Zusammenfassung:1. A composition containing (a) an epoxy resin having more than one epoxy group, and (b) a polyimide consisting essentially of the recurring unit of the formula see diagramm : EP0099338,P15,F1 wherein the four carbonyl groups are attached directly to different carbon atoms, the carbonyl groups being ortho or peri to each other so that five- or six-membered imide rings are formed ; Z is a tetravalent radical containing at least one aromatic ring, the carbonyl groups being attached to the ring ; and Z' is a divalent organic radical selected from aromatic, aliphatic alkyl aromatic, cycloaliphatic, and heterocyclic radicals, combinations of these, and radicals with heteroatom-containing bridging groups where the heteroatom in the bridge is oxygen, sulfur, nitrogen, silicon or phosphorus ; said polyimide (b) being present in a concentration of 0.5 to 50% by weight, based on said composition, and being present as a substantially discontinuous phase within the epoxy resin.