Telescopic thermal conduction element for semiconductor devices
A telescoping heat exchange element (24) for conducting heat in a semiconductor package from a device (10) to a spaced heat sink (16) having a first cup-shaped member (26), a second cup-shaped member (32) positioned in telescoping slidable relation with said first member, and means (30, 36) to provi...
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| creator | BALDERES, DEMETRIOS HORVATH, JOSEPH LOUIS LIPSCHUTZ, LEWIS DRUCKER |
| description | A telescoping heat exchange element (24) for conducting heat in a semiconductor package from a device (10) to a spaced heat sink (16) having a first cup-shaped member (26), a second cup-shaped member (32) positioned in telescoping slidable relation with said first member, and means (30, 36) to provide a firm sliding contact between said first and second members. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP0088246A2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP0088246A2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP0088246A23</originalsourceid><addsrcrecordid>eNrjZLAPSc1JLU7OL8hMVijJSC3KTcxRSM7PSylNLsnMz1MASuam5pUopOUXKRSn5mZCpYC8lNSyzOTUYh4G1rTEnOJUXijNzaDg5hri7KGbWpAfn1pckJicmpdaEu8aYGBgYWFkYuZoZEyEEgCJJjFJ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Telescopic thermal conduction element for semiconductor devices</title><source>esp@cenet</source><creator>BALDERES, DEMETRIOS ; HORVATH, JOSEPH LOUIS ; LIPSCHUTZ, LEWIS DRUCKER</creator><creatorcontrib>BALDERES, DEMETRIOS ; HORVATH, JOSEPH LOUIS ; LIPSCHUTZ, LEWIS DRUCKER</creatorcontrib><description>A telescoping heat exchange element (24) for conducting heat in a semiconductor package from a device (10) to a spaced heat sink (16) having a first cup-shaped member (26), a second cup-shaped member (32) positioned in telescoping slidable relation with said first member, and means (30, 36) to provide a firm sliding contact between said first and second members.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>1983</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19830914&DB=EPODOC&CC=EP&NR=0088246A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19830914&DB=EPODOC&CC=EP&NR=0088246A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BALDERES, DEMETRIOS</creatorcontrib><creatorcontrib>HORVATH, JOSEPH LOUIS</creatorcontrib><creatorcontrib>LIPSCHUTZ, LEWIS DRUCKER</creatorcontrib><title>Telescopic thermal conduction element for semiconductor devices</title><description>A telescoping heat exchange element (24) for conducting heat in a semiconductor package from a device (10) to a spaced heat sink (16) having a first cup-shaped member (26), a second cup-shaped member (32) positioned in telescoping slidable relation with said first member, and means (30, 36) to provide a firm sliding contact between said first and second members.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1983</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAPSc1JLU7OL8hMVijJSC3KTcxRSM7PSylNLsnMz1MASuam5pUopOUXKRSn5mZCpYC8lNSyzOTUYh4G1rTEnOJUXijNzaDg5hri7KGbWpAfn1pckJicmpdaEu8aYGBgYWFkYuZoZEyEEgCJJjFJ</recordid><startdate>19830914</startdate><enddate>19830914</enddate><creator>BALDERES, DEMETRIOS</creator><creator>HORVATH, JOSEPH LOUIS</creator><creator>LIPSCHUTZ, LEWIS DRUCKER</creator><scope>EVB</scope></search><sort><creationdate>19830914</creationdate><title>Telescopic thermal conduction element for semiconductor devices</title><author>BALDERES, DEMETRIOS ; HORVATH, JOSEPH LOUIS ; LIPSCHUTZ, LEWIS DRUCKER</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP0088246A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1983</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>BALDERES, DEMETRIOS</creatorcontrib><creatorcontrib>HORVATH, JOSEPH LOUIS</creatorcontrib><creatorcontrib>LIPSCHUTZ, LEWIS DRUCKER</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BALDERES, DEMETRIOS</au><au>HORVATH, JOSEPH LOUIS</au><au>LIPSCHUTZ, LEWIS DRUCKER</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Telescopic thermal conduction element for semiconductor devices</title><date>1983-09-14</date><risdate>1983</risdate><abstract>A telescoping heat exchange element (24) for conducting heat in a semiconductor package from a device (10) to a spaced heat sink (16) having a first cup-shaped member (26), a second cup-shaped member (32) positioned in telescoping slidable relation with said first member, and means (30, 36) to provide a firm sliding contact between said first and second members.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS |
| title | Telescopic thermal conduction element for semiconductor devices |
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