Telescopic thermal conduction element for semiconductor devices

Telescopic thermal conduction element for semiconductor devices

A telescoping heat exchange element (24) for conducting heat in a semiconductor package from a device (10) to a spaced heat sink (16) having a first cup-shaped member (26), a second cup-shaped member (32) positioned in telescoping slidable relation with said first member, and means (30, 36) to provi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: BALDERES, DEMETRIOS, HORVATH, JOSEPH LOUIS, LIPSCHUTZ, LEWIS DRUCKER
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
BLASTING
DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEATING
LIGHTING
MECHANICAL ENGINEERING
SEMICONDUCTOR DEVICES
WEAPONS
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Beschreibung
Zusammenfassung:A telescoping heat exchange element (24) for conducting heat in a semiconductor package from a device (10) to a spaced heat sink (16) having a first cup-shaped member (26), a second cup-shaped member (32) positioned in telescoping slidable relation with said first member, and means (30, 36) to provide a firm sliding contact between said first and second members.