CARRIER FOR A LEADLESS INTEGRATED CIRCUIT CHIP

A carrier (2) for a leadless integrated circuit chip (42) has a cavity (22) into which a chip is laterally inserted through an opening (24) in a side wall of the carrier. A spring arm (36) formed integrally with the carrier flexes backward in a recess (30) to permit insertion of the chip, which has...

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Bibliographische Detailangaben
1. Verfasser:	MORTON, WILLIAM D., JR
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A carrier (2) for a leadless integrated circuit chip (42) has a cavity (22) into which a chip is laterally inserted through an opening (24) in a side wall of the carrier. A spring arm (36) formed integrally with the carrier flexes backward in a recess (30) to permit insertion of the chip, which has plurality of electrical contact pads (44) on its upper surface, and then bears it within the cavity. Tabs (40) at the upper corners of the cavity prevent the chip from escaping while exposing the pads for both single and dual pin probing. The external configuration of the carrier conforms to industry standards so that the chip can be fully processed and tested without removing it from the carrier.