PINNED CERAMIC SUBSTRATE AND METHOD OF MAKING SUCH

Ceramic substrates are pinned using powdered metallurgy pins formed in situ on a substrate body. The method includes providing a substrate body with first holes, a carrier with second holes, filling said first and second holes with a powdered metallurgy and juxtaposing them, and providing one or mor...

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Bibliographische Detailangaben
Hauptverfasser:	FUNARI, JOSEPH, KOTRCH, GEORGE STEVE, DARROW, RUSSELL ELWOOD, JR, PHILLIPS, GEORGE CHARLES, JR
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Ceramic substrates are pinned using powdered metallurgy pins formed in situ on a substrate body. The method includes providing a substrate body with first holes, a carrier with second holes, filling said first and second holes with a powdered metallurgy and juxtaposing them, and providing one or more heat treatments to sinter said metallurgy to form the pins and, preferably, vaporize said carrier.