PROCESS FOR ETCHING METAL SURFACES

1. Process for etching metal surfaces, in particular printed circuits, wherein the metal (such as copper) is corroded off the circuit by means of a solution containing sulfuric acid or phosphoric acid and hydrogen peroxide and this solution is passed through a cycle and used repeatedly for etching,...

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Bibliographische Detailangaben
1. Verfasser:	SCHMID, DIETER C., GRAD
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
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Beschreibung
Zusammenfassung:	1. Process for etching metal surfaces, in particular printed circuits, wherein the metal (such as copper) is corroded off the circuit by means of a solution containing sulfuric acid or phosphoric acid and hydrogen peroxide and this solution is passed through a cycle and used repeatedly for etching, characterized in that hydrogen peroxide is added to the solution immediately prior to each application or during application to the circuit to be etched in such an amount that it is just sufficient for each etching procedure and substantially no hydrogen peroxide remains in the solution after the etching procedure.