THERMOSETTING MOULDING COMPOUNDS, PROCESS FOR THEIR PRODUCTION AND THEIR USE IN A PROCESS FOR PREPARING MOULDED ARTICLES

THERMOSETTING MOULDING COMPOUNDS, PROCESS FOR THEIR PRODUCTION AND THEIR USE IN A PROCESS FOR PREPARING MOULDED ARTICLES

The instant invention is directed to a substantially solvent-free molding material, comprising (A) from 92 to 30% by weight, of an active-hydrogen containing prepolymer containing: from 0.3 to 4% by weight, based on the prepolymer, of free primary and/or secondary amino groups, from 1.5 to 10% by we...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GROGLER, GERHARD, RECKER, KLAUS
Format: Patent
Sprache:eng ; ger
Schlagworte:
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
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Beschreibung
Zusammenfassung:The instant invention is directed to a substantially solvent-free molding material, comprising (A) from 92 to 30% by weight, of an active-hydrogen containing prepolymer containing: from 0.3 to 4% by weight, based on the prepolymer, of free primary and/or secondary amino groups, from 1.5 to 10% by weight, based on the prepolymer, of urethane groups, and from 1.5 to 10% by weight, based on the prepolymer, of urea groups; (B) from 24 to 1% by weight of a polyisocyanate having a melting point above 120 DEG C.; and (C) from 5 to 69% by weight of an organic or inorganic fibrous material with a fiber length of from 0.1 to 100 mm, the equivalent ratio between NCO groups, including masked NCO groups, and active H-atoms of components (A) and (B) is between 1:1 and 1:1.75. The instant invention is also directed to a process for the production of the substantially solvent-free molding material.