PROCESS AND DEVICE FOR TESTING A CONNECTOR CLIP OF A SOLDERLESS ELECTRICAL CONNECTION

An apparatus and method for testing the mechanical strength of a solderless electrical connection having a clamp deformable to retain a bundle of wires against a pin has a double-T-shaped cross piece over which a clamp to be tested is slided. The cross piece has a vertical bore therein for receiving...

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Hauptverfasser: SEITZ, MAX, THUMM, HANS-PETER, HAGEN, GUNTHER, GRAD, GERALD
Format: Patent
Sprache:eng ; ger
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Beschreibung
Zusammenfassung:An apparatus and method for testing the mechanical strength of a solderless electrical connection having a clamp deformable to retain a bundle of wires against a pin has a double-T-shaped cross piece over which a clamp to be tested is slided. The cross piece has a vertical bore therein for receiving a pressure-applying die for subjecting the clamp to a test pressure. The die is actuated by a motor-driven spindle and a transducer transforms the applied pressure to a voltage for display. Pressure is applied following a pre-determined curve corresponding to worst cast configurations of a wire bundle which may result in failure of the clamp to securely retain the bundle.