TONING AND SOLVENT WASHOUT PROCESS FOR MAKING CONDUCTIVE INTERCONNECTIONS

By the process of this invention, two-layer printed circuits having conductive interconnections are prepared by applying a photoadhesive layer to a substrate bearing an electrically conductive circuit pattern, exposing the photoadhesive layer to a circuit image related to a circuit pattern to produc...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	PEIFFER, ROBERT WILLIAM
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	By the process of this invention, two-layer printed circuits having conductive interconnections are prepared by applying a photoadhesive layer to a substrate bearing an electrically conductive circuit pattern, exposing the photoadhesive layer to a circuit image related to a circuit pattern to produce adherent circuit image areas having segments overlying the circuit pattern, applying metal powder to the adherent image areas, exposing the resultant image areas to an image of the overlying segments, removing the overlying segment areas of the photoadhesive layer with a suitable solvent, and soldering or plating the resultant image areas to form an electrically conductive pattern interconnected with the underlying circuit pattern.