SILVER-BASED SOLDER

A silver-based solder comprises copper and zinc, characterized in that it further comprises indium with the following component ratio, wt %: silver 64.5-65.5; copper 19.5-20.5; indium 3-5; zinc is the rest. An additional introduction of indium to solder alloy on the basis of silver, containing coppe...

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Hauptverfasser: BABUSHKIN OLEG, VIKTOROVICH, COKOLOV RISLAN, EVGENIEVICH, SIDELNIKOV SERGEJ, BORISOVICH, USKOV IGOR, VASILIEVICH, SHUBAKOV ALEXANDER, PAVLOVICH, BELYAEV SERGEJ, VLADIMIROVICH, USKOV DANIL, IGOREVICH, GOROKHOV YURY, VASILIEVICH, GUSCHINSKIJ ANDREJ, ANATOLIEVICH, MALTSEV EDUARD, VLADIMIROVICH, VINOGRADOV OLEG, OLEGOVICH, PAVLOV EVGENIJ, ALEXANDROVICH, BOGDANOV DMITRIJ, VLADIMIROVICH, GUBANOV IVAN, YURIEVICH
Format: Patent
Sprache:eng ; rus
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