FREMGANGSMÅDE TIL FREMSTILLING AF EN STRUKTUR VED BRUG AF STEP-AND-REPEAT-PRÆGETEKNIK
A method of manufacturing a structure that is capable of suppressing in-mask curing corrosion while minimizing influence on shape stability of a fine pattern to be transferred to a resin layer is provided. According to the present invention, a method of manufacturing a structure is provided that inc...
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| creator | MIYAZAWA, Yukihiro |
| description | A method of manufacturing a structure that is capable of suppressing in-mask curing corrosion while minimizing influence on shape stability of a fine pattern to be transferred to a resin layer is provided. According to the present invention, a method of manufacturing a structure is provided that includes: lamination forming, forming a lamination including, on a transparent substrate, a resin layer of an imprinting photo curable resin composition containing a photopolymerizable monomer and 0.1 parts by mass or more respectively of a photo initiator and a polymerization inhibitor based on 100 parts by mass of the monomer; covering, pressing a fine pattern of a mold on the resin layer and covering the lamination with a shading mask to cause at least part of a region where the mold is pressed on in the resin layer to be an exposed region; curing the resin layer in the exposed region by radiating curing light to the resin layer; and repeating the covering and the curing one or more times by moving the mold to an uncured area in the resin layer. |
| format | Patent |
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According to the present invention, a method of manufacturing a structure is provided that includes: lamination forming, forming a lamination including, on a transparent substrate, a resin layer of an imprinting photo curable resin composition containing a photopolymerizable monomer and 0.1 parts by mass or more respectively of a photo initiator and a polymerization inhibitor based on 100 parts by mass of the monomer; covering, pressing a fine pattern of a mold on the resin layer and covering the lamination with a shading mask to cause at least part of a region where the mold is pressed on in the resin layer to be an exposed region; curing the resin layer in the exposed region by radiating curing light to the resin layer; and repeating the covering and the curing one or more times by moving the mold to an uncured area in the resin layer.</description><language>dan</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180614&DB=EPODOC&CC=DK&NR=3073513T3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180614&DB=EPODOC&CC=DK&NR=3073513T3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIYAZAWA, Yukihiro</creatorcontrib><title>FREMGANGSMÅDE TIL FREMSTILLING AF EN STRUKTUR VED BRUG AF STEP-AND-REPEAT-PRÆGETEKNIK</title><description>A method of manufacturing a structure that is capable of suppressing in-mask curing corrosion while minimizing influence on shape stability of a fine pattern to be transferred to a resin layer is provided. According to the present invention, a method of manufacturing a structure is provided that includes: lamination forming, forming a lamination including, on a transparent substrate, a resin layer of an imprinting photo curable resin composition containing a photopolymerizable monomer and 0.1 parts by mass or more respectively of a photo initiator and a polymerization inhibitor based on 100 parts by mass of the monomer; covering, pressing a fine pattern of a mold on the resin layer and covering the lamination with a shading mask to cause at least part of a region where the mold is pressed on in the resin layer to be an exposed region; curing the resin layer in the exposed region by radiating curing light to the resin layer; and repeating the covering and the curing one or more times by moving the mold to an uncured area in the resin layer.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAh3C3L1dXf0cw_2Pdzq4qoQ4umjABIKBjJ8PP3cFRzdFFz9FIJDgkK9Q0KDFMJcXRScgkLB4sEhrgG6jn4uukGuAa6OIboBQYfb3F1DXL39PL15GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakm8i7exgbmxqaFxSIixMTFqAIakMsM</recordid><startdate>20180614</startdate><enddate>20180614</enddate><creator>MIYAZAWA, Yukihiro</creator><scope>EVB</scope></search><sort><creationdate>20180614</creationdate><title>FREMGANGSMÅDE TIL FREMSTILLING AF EN STRUKTUR VED BRUG AF STEP-AND-REPEAT-PRÆGETEKNIK</title><author>MIYAZAWA, Yukihiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_DK3073513TT33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>dan</language><creationdate>2018</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>MIYAZAWA, Yukihiro</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIYAZAWA, Yukihiro</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FREMGANGSMÅDE TIL FREMSTILLING AF EN STRUKTUR VED BRUG AF STEP-AND-REPEAT-PRÆGETEKNIK</title><date>2018-06-14</date><risdate>2018</risdate><abstract>A method of manufacturing a structure that is capable of suppressing in-mask curing corrosion while minimizing influence on shape stability of a fine pattern to be transferred to a resin layer is provided. According to the present invention, a method of manufacturing a structure is provided that includes: lamination forming, forming a lamination including, on a transparent substrate, a resin layer of an imprinting photo curable resin composition containing a photopolymerizable monomer and 0.1 parts by mass or more respectively of a photo initiator and a polymerization inhibitor based on 100 parts by mass of the monomer; covering, pressing a fine pattern of a mold on the resin layer and covering the lamination with a shading mask to cause at least part of a region where the mold is pressed on in the resin layer to be an exposed region; curing the resin layer in the exposed region by radiating curing light to the resin layer; and repeating the covering and the curing one or more times by moving the mold to an uncured area in the resin layer.</abstract><oa>free_for_read</oa></addata></record> |
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| language | dan |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | FREMGANGSMÅDE TIL FREMSTILLING AF EN STRUKTUR VED BRUG AF STEP-AND-REPEAT-PRÆGETEKNIK |
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