FREMSTILLING AF TYNDE SILIKONEFOLIER

Thin silicon films of high thickness uniformity and thicknesses of from 0.1 μm to 200 μm are prepared by applying a crosslinkable silicone composition to a moving carrier by means of a slot die, removing solvent, if present, and subsequently crosslinking the silicone layer formed on the carrier.

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Bibliographische Detailangaben
Hauptverfasser:	SCHWINGHAMMER, Alfred, KÖLLNBERGER, Andreas
Format:	Patent
Sprache:	dan
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	Thin silicon films of high thickness uniformity and thicknesses of from 0.1 μm to 200 μm are prepared by applying a crosslinkable silicone composition to a moving carrier by means of a slot die, removing solvent, if present, and subsequently crosslinking the silicone layer formed on the carrier.