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Partially cured phenolic foams having a cell structure that is resistant to rupture under pressure and a slow deterioration of thermal insulation value are described. These foams can be cured to achieve dimensional stability without substantial adverse affect on their structure.

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Bibliographische Detailangaben
Hauptverfasser:	KAVANAGH D L, CLARK R C
Format:	Patent
Sprache:	dan
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	Partially cured phenolic foams having a cell structure that is resistant to rupture under pressure and a slow deterioration of thermal insulation value are described. These foams can be cured to achieve dimensional stability without substantial adverse affect on their structure.