Klæbesammensætning og struktur omfattende mindst et lag af nævnte sammensætning

Adhesive composition comprises: polyamide A having an average carbon atoms (4-8.5, preferably 4-7) per nitrogen atom (CA); polyamide B having a fusion temperature of >= 180[deg] C and an average number of carbon atoms (7-10, preferably 7.5-9.5) per nitrogen atom (CB); and polyamide C having an av...

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Bibliographische Detailangaben
Hauptverfasser:	FERREIRO, VINCENT, MONTANARI, THIBAUT, MONTEZIN, FABRICE
Format:	Patent
Sprache:	dan
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BLASTING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING JOINTS OR FITTINGS FOR PIPES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LIGHTING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE MEANS FOR THERMAL INSULATION IN GENERAL MECHANICAL ENGINEERING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS PIPES POLISHES SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING THEIR PREPARATION OR CHEMICAL WORKING-UP THERMAL INSULATION IN GENERAL TRANSPORTING USE OF MATERIALS AS ADHESIVES WEAPONS
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