Klæbesammensætning og struktur omfattende mindst et lag af nævnte sammensætning

Adhesive composition comprises: polyamide A having an average carbon atoms (4-8.5, preferably 4-7) per nitrogen atom (CA); polyamide B having a fusion temperature of >= 180[deg] C and an average number of carbon atoms (7-10, preferably 7.5-9.5) per nitrogen atom (CB); and polyamide C having an av...

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Bibliographische Detailangaben
Hauptverfasser:	FERREIRO, VINCENT, MONTANARI, THIBAUT, MONTEZIN, FABRICE
Format:	Patent
Sprache:	dan
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BLASTING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING JOINTS OR FITTINGS FOR PIPES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LIGHTING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE MEANS FOR THERMAL INSULATION IN GENERAL MECHANICAL ENGINEERING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS PIPES POLISHES SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING THEIR PREPARATION OR CHEMICAL WORKING-UP THERMAL INSULATION IN GENERAL TRANSPORTING USE OF MATERIALS AS ADHESIVES WEAPONS
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Beschreibung
Zusammenfassung:	Adhesive composition comprises: polyamide A having an average carbon atoms (4-8.5, preferably 4-7) per nitrogen atom (CA); polyamide B having a fusion temperature of >= 180[deg] C and an average number of carbon atoms (7-10, preferably 7.5-9.5) per nitrogen atom (CB); and polyamide C having an average number of carbon atoms (9-18, preferably 10-18) per nitrogen atom (CC), where 50 wt.% of the composition formed by one or more polyamides of polyamide A, B and C, where the mass weighted average of melting enthalpy of polyamides in the composition is greater than 25 J/g. Adhesive composition comprises: polyamide A having an average carbon atoms (4-8.5, preferably 4-7) per nitrogen atom (CA); polyamide B having a fusion temperature of >= 180[deg] C and an average number of carbon atoms (7-10, preferably 7.5-9.5) per nitrogen atom (CB); and polyamide C having an average number of carbon atoms (9-18, preferably 10-18) per nitrogen atom (CC), where 50 wt.% of the composition formed by one or more polyamides of polyamide A, B and C, where the mass weighted average of melting enthalpy of polyamides in the composition is greater than 25 J/g measured by differential scanning calorimetry (DSC), and the average number of carbon atoms (per nitrogen atom) of polyamides A, B and C is CA less than CB, which is less than CC. An independent claim is included for a structure comprising at least two layers, where one of two layers of adhesive layer (a) is constituted of the adhesive composition,.