POWER MODULE WITH COOLING FINS IMPROVING MECHANICAL STRENGTH

The present invention provides an electric power module (PM) arranged for liquid cooling, the electric power module comprising at least a first semiconductor chip, comprising at least one power electronic switch component. The power module (PM) has a base plate (BP) with an upper surface attached to a lower surface of a non-conductive substrate, wherein the base plate (BP) has a lower surface arranged for direct contact with a cooling liquid (CL), wherein the lower surface has a length and a width. One or more fin structure(s) (F) is directly attached to the lower surface of the base plate (PB) and being arranged to guide a cooling liquid (CL) along a length direction (L) of the lower surface of base plate (BP). The fin structure(s) (F) is shaped to provide a turbulence of the cooling liquid (CL) when flowing along the base plate (BP), and wherein the one or more fin structures serves to provide mechanical strength to the base plate, so as to limit a bending of the base plate upon application of a pressure of the cooling liquid.