Kredsløbsapparat med bundet SMD-komponent

The circuit device has a surface mount device (SMD) construction unit(13) and an electronic component. The SMD construction unit and the electronic component are connected by a wire-bond-connection. A printed circuit board substrate (10) is provided in the circuit device and the SMD component is mou...

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Bibliographische Detailangaben
Hauptverfasser:	CHAN, CHOR FAN, LIM, MENG KIANG
Format:	Patent
Sprache:	dan
Schlagworte:	BASIC ELECTRIC ELEMENTS DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The circuit device has a surface mount device (SMD) construction unit(13) and an electronic component. The SMD construction unit and the electronic component are connected by a wire-bond-connection. A printed circuit board substrate (10) is provided in the circuit device and the SMD component is mounted on an integrated switch (12) and is electrically connected to it by a wire (14).