Fremgangsmåde og anordning til en varmechokbehandling af löse materialer
The invention relates to mechanisation of a short-term heat treatment process and /or to hardening loose materials, and can be used at a stage of thermochemical activation in the production of catalysts, carriers, adsorbent agents, dehumidifiers, filling agents, ceramics, magnetic materials, inorgan...
Gespeichert in:
Hauptverfasser: | , , , , , , , , |
---|---|
Format: | Patent |
Sprache: | dan |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention relates to mechanisation of a short-term heat treatment process and /or to hardening loose materials, and can be used at a stage of thermochemical activation in the production of catalysts, carriers, adsorbent agents, dehumidifiers, filling agents, ceramics, magnetic materials, inorganic pigments, solid electrolytes, medicinal and cosmetic preparations etc, for drying and cooling processes in the chemical, food and woodworking industries, etc. The invention makes it possible to adjust a loose material flow rate, orderly distribute it on a hot surface providing a firm contact between the material and the surface, accelerate the heating of the loose material, reduce a time of contact, to rapidly heat and harden a heat treated product in order to fix the metastable structure thereof and reduce the energy consumption. The inventive device for heat shock treatment of loose materials comprises a vertical shaft arranged inside a body and provided with a plate fixed thereto, a material flow adjustment unit mounted in the lower part of a reservoir for basic material. The shaft is rotated by a drive. Said device also comprises a system for cooling and hardening heat shock treated products. A working surface of the plate is embodied conical or curved in such a way that it is allows said surface to be enlarged upwards. The inventive method for a heat shock treatment of the loose materials using said device is also disclosed. |
---|