Heissschmelzklebstoff mit niedriger Anwendungstemperatur

A low application temperature hot met adhesive composition and its use in carton, case or tray formation comprising from ethylene vinyl acetate with greater than 30 weight percent VA and having a melt index of at least 700; a thermoplastic hydrocarbon resin derived from styrene, alpha-methylstyrene,...

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Bibliographische Detailangaben
Hauptverfasser:	MEHAFFY, JUSTIN A, COLE, INGRID
Format:	Patent
Sprache:	ger
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING DYES HANDLING THIN OR FILAMENTARY MATERIAL METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PACKAGES PACKAGING ELEMENTS PACKING PAINTS PERFORMING OPERATIONS POLISHES STORING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A low application temperature hot met adhesive composition and its use in carton, case or tray formation comprising from ethylene vinyl acetate with greater than 30 weight percent VA and having a melt index of at least 700; a thermoplastic hydrocarbon resin derived from styrene, alpha-methylstyrene, and/or vinyltoluene, and polymers, copolymers and terpolymers thereof; a compatible adhesive promoting tackifier; and wax with a melting point of about 130 to 170 DEG F; and optionally comprising ethylene vinyl acetate with less than about 30 weight percent by weight of vinyl acetate and having a melt index of about 400 to 2500.