LÖTPULVER UND VERFAHREN ZUR HERSTELLUNG DESSELBEN UND LÖTPASTE

An organic acid salt is deposited on the surface of a solder powder containing Sn and Zn. Alternatively, 0.5 to 10 wt.% of a nonionic surfactant is added to a flux. By a method comprising such a procedure, provided are a lead-free solder powder and solder paste having good soldering characteristics...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SENNA, MAMORU, HIRATA, MASAHIKO, YOSHIDA, HISAHIKO, HISAZUMI, TAKAO, ISOBE, TETSUHIKO, OHASHI, TAKASHI, NOGUCHI, HIROJI
Format:	Patent
Sprache:	ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An organic acid salt is deposited on the surface of a solder powder containing Sn and Zn. Alternatively, 0.5 to 10 wt.% of a nonionic surfactant is added to a flux. By a method comprising such a procedure, provided are a lead-free solder powder and solder paste having good soldering characteristics wherein the reaction of an activating component with an alloy component in a flux is suppressed.