KÜHLEINRICHTUNG UND KÜHLVERFAHREN

A cooling device capable of reducing the amount of frost deposited on a cooling coil (7), wherein cooling fans (8a, 8b) are disposed at the front of the cooling coil (7), most of the flowing air discharged into a cooling chamber is discharged again into the cooling chamber by the cooling fans (8a, 8...

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Bibliographische Detailangaben
1. Verfasser:	FURUBAYASHI, YASUO
Format:	Patent
Sprache:	ger
Schlagworte:	AIR-CONDITIONING, AIR-HUMIDIFICATION, VENTILATION, USE OF AIRCURRENTS FOR SCREENING BLASTING COLD ROOMS COMBINED HEATING AND REFRIGERATION SYSTEMS COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS FOODS OR FOODSTUFFS FOODS, FOODSTUFFS, OR NON-ALCOHOLIC BEVERAGES, NOT COVERED BYSUBCLASSES A23B - A23J HEAT PUMP SYSTEMS HEATING HUMAN NECESSITIES HYGIENE ICE-BOXES LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING MEDICAL OR VETERINARY SCIENCE PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOSES PRESERVATION OF FOODS OR FOODSTUFFS, IN GENERAL RANGES REFRIGERATION OR COOLING REFRIGERATORS THEIR PREPARATION OR TREATMENT, e.g. COOKING, MODIFICATION OFNUTRITIVE QUALITIES, PHYSICAL TREATMENT THEIR TREATMENT, NOT COVERED BY OTHER CLASSES VENTILATING WEAPONS
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Beschreibung
Zusammenfassung:	A cooling device capable of reducing the amount of frost deposited on a cooling coil (7), wherein cooling fans (8a, 8b) are disposed at the front of the cooling coil (7), most of the flowing air discharged into a cooling chamber is discharged again into the cooling chamber by the cooling fans (8a, 8b) without being returned to the cooling coil (7), dry cooling air in the cooling coil (7) is sucked from the rear of the cooling fans (8a, 8b) and discharged into the cooling chamber, an air volume corresponding to the volume of sucked air passed through the cooling coil (7) is fed from the cooling chamber to the cooling coil (7) through areas not occupied by the cooling fans (8a, 8b), and the air feeding speed is so set as to permit vapor generated in the cooling chamber to solidify until the vapor is brought into contact with the surface of the cooling coil (7).