SCHLEIFMITTELZUSAMMENSETZUNG ZUM POLIEREN EINES HALBLEITERBAUTEILS UND HERSTELLUNG DES HALBLEITERBAUTEILS MIT DERSELBEN

An abrasive composition for polishing a semiconductor device, comprising cerium oxide, a water-soluble organic compound having at least one group of -COOH, -COOMX (wherein MX is an atom or a functional group capable of substituting a H atom to form a salt), -SO3H or -SO3MY (wherein MY is an atom or...

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Bibliographische Detailangaben
Hauptverfasser:	KIDO, TAKANORI, ICHIKAWA, KAGETAKA
Format:	Patent
Sprache:	ger
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An abrasive composition for polishing a semiconductor device, comprising cerium oxide, a water-soluble organic compound having at least one group of -COOH, -COOMX (wherein MX is an atom or a functional group capable of substituting a H atom to form a salt), -SO3H or -SO3MY (wherein MY is an atom or a functional group capable of substituting a H atom to form a salt), and water a process for forming shallow trench isolations using this abrasive composition.