Verfahren zum Schutz elektronischer Bauelemente

There is disclosed herein an electronic circuit having improved protection against harsh environments, a preferred embodiment thereof comprising: a substrate 10 having a top surface 12; an electronic component 14 attached to the top surface of the substrate; a plastic and metal foil laminated barrie...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DAILEY, DANIEL PHILLIP, NATION, BRENDA JOYCE, BEDNARZ, MICHAEL, GOENKA, LAKHI NANDLAL, LI, DELIN, SCHWEITZER, CHARLES FREDERICK
Format:	Patent
Sprache:	ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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