Verfahren zum Schutz elektronischer Bauelemente

There is disclosed herein an electronic circuit having improved protection against harsh environments, a preferred embodiment thereof comprising: a substrate 10 having a top surface 12; an electronic component 14 attached to the top surface of the substrate; a plastic and metal foil laminated barrie...

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Bibliographische Detailangaben
Hauptverfasser:	DAILEY, DANIEL PHILLIP, NATION, BRENDA JOYCE, BEDNARZ, MICHAEL, GOENKA, LAKHI NANDLAL, LI, DELIN, SCHWEITZER, CHARLES FREDERICK
Format:	Patent
Sprache:	ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	There is disclosed herein an electronic circuit having improved protection against harsh environments, a preferred embodiment thereof comprising: a substrate 10 having a top surface 12; an electronic component 14 attached to the top surface of the substrate; a plastic and metal foil laminated barrier 16 having an outer periphery 18 thereabout, the outer periphery being sealably attached to the top surface 12 of the substrate so as to define a closed pocket 20 between the top surface 12 and the barrier 16 within which the electronic component 14 is enclosed; and a desiccant element 50.