Elektronisches Leistungsmodul und Leistungsgerät damit

The electronic module stacking construction method has individual modules (1) each with a power transistor (5). Individual units are stacked vertically face to face. Each substrate pair has separating pillars (3) each side of the substrate which act as interconnectors touching inter connecting pads....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RANCHY, ERIC, PETITBON, ALAIN
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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