Elektronisches Leistungsmodul und Leistungsgerät damit
The electronic module stacking construction method has individual modules (1) each with a power transistor (5). Individual units are stacked vertically face to face. Each substrate pair has separating pillars (3) each side of the substrate which act as interconnectors touching inter connecting pads....
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| Format: | Patent |
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| Zusammenfassung: | The electronic module stacking construction method has individual modules (1) each with a power transistor (5). Individual units are stacked vertically face to face. Each substrate pair has separating pillars (3) each side of the substrate which act as interconnectors touching inter connecting pads. Each substrate rear slab is cooled by an air cooled cooling slab (2) forming substrate pair stacks and outer cooling fins with a side air cooling duct (18). |
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