Hochtemperatur-Supraleitfähigkeit in einem gespannten Si/SiGe-Übergang

A structure based on strained Si/SiGe that has high temperature superconductivity is disclosed. The structure for carrying superconducting current includes a substrate (12); a first epitaxial P type semiconductor layer (14), which is under compressive strain, for transporting holes; a second epitaxial barrier layer (20) positioned on the first layer (14); and a third epitaxial N type semiconductor layer (24), which is under tensile strain, for transporting electrons. The barrier layer (30) is thick enough to restrict recombination of electrons and holes, yet the barrier layer (30) is thin enough to permit coulomb force attraction between the electrons and holes to form electron-hole pairs. The first and second layers (14,20) include SiGe, such as Si1.xGex, where x is 0.6-0.8 for the first layer (14), and 0.3-0.4 for the second layer (20). The third layer (24) includes Si.