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A soldering method for soldering electronic components onto a copper (Cu) substrate using a tin (Sn) solder alloy. The method consists in pretreating the Cu substrate by depositing a thin layer of zinc (Zn) before the deposition of the Sn solder alloy. This method greatly enhance the mechanical and...

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Bibliographische Detailangaben
Hauptverfasser:	CAVALLOTTI, PIETRO LUIGI, SIRTORI, VITTORIO, MONZANI, ADELIO, ZANGARI, GIOVANNI
Format:	Patent
Sprache:	ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A soldering method for soldering electronic components onto a copper (Cu) substrate using a tin (Sn) solder alloy. The method consists in pretreating the Cu substrate by depositing a thin layer of zinc (Zn) before the deposition of the Sn solder alloy. This method greatly enhance the mechanical and electrical properties of the solder alloy, allowing the use of lead (Pb) free alloys such as tin-bismuth (Sn-Bi).