LOTVERTEILUNGSGERÄT
A solder dispensing apparatus for depositing fluid solder into and around a pin-in-through-hole joining zone of an electronic circuit board which comprises: a valve assembly defining a valve chamber with an inlet and an outlet, and having the valve member actuated by the pin of said pin-in-through-h...
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Format: | Patent |
Sprache: | ger |
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Zusammenfassung: | A solder dispensing apparatus for depositing fluid solder into and around a pin-in-through-hole joining zone of an electronic circuit board which comprises: a valve assembly defining a valve chamber with an inlet and an outlet, and having the valve member actuated by the pin of said pin-in-through-hole joining zone when the valve is positioned at the zone against the board, the valve member moving from a first position closing off fluid flow from the outlet to a second position permitting fluid flow through the outlet; means for measuring a predetermined body of fluid solder that is released from the chamber when said valve member is in the second position with the assembly positioned at the zone against the board; and means to contain the released fluid solder in a predetermined shape and in and around the pin-in-through-hole joining zone while the solder solidifies. |
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