FOLIEN MIT BEI HOHEN TEMPERATUREN STABILER SCHUTZSCHICHT

A method for protecting a substrate sheet such as a conductive foil suitable for use in the manufacture of printed circuit boards involves applying a release coat (24) to one side of a protective film (12) and then applying an electron beam curable adhesive coating (34) on the other side of the film...

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Bibliographische Detailangaben
Hauptverfasser:	KEOUGH, ALLEN H, WILHEIM, MARTIN
Format:	Patent
Sprache:	ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	A method for protecting a substrate sheet such as a conductive foil suitable for use in the manufacture of printed circuit boards involves applying a release coat (24) to one side of a protective film (12) and then applying an electron beam curable adhesive coating (34) on the other side of the film (12), curing the adhesive coating (34) and laminating the protective film (12) to a circuit board. The laminate product (10) is a protected substrate sheet having a protective film (12) laminated to one side of the sheet, the film (12) having a release coating (24) on one side thereof and an electron beam cured adhesive coating (34) and the other side thereof, said other side being in adhesive contacting relationship with said substrate sheet.