Epoxydharz und Polyesterharz enthaltende heissschmelzbare Zusammensetzungen

Hot melt compositions comprise from 2 to 95 parts of an epoxy-containing material, correspondingly, from about 98 to 5 parts of a polyester component, an effective amount of a photoinitiator for radiation curing the hot melt composition, and an optional hydroxyl-containing material. The hot melt com...

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Bibliographische Detailangaben
Hauptverfasser:	STOBBIE, IV, GEORGE, CLAYTON A
Format:	Patent
Sprache:	ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FORVEHICLES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES VEHICLES IN GENERAL VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISEPROVIDED FOR WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILARDEVICES FOR VEHICLES
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Beschreibung
Zusammenfassung:	Hot melt compositions comprise from 2 to 95 parts of an epoxy-containing material, correspondingly, from about 98 to 5 parts of a polyester component, an effective amount of a photoinitiator for radiation curing the hot melt composition, and an optional hydroxyl-containing material. The hot melt composition is a solid at room temperature but can be melted to a liquid upon heating. The invention also relate to a method of adhesively bonding two substrates together using the hot melt compositions.