VERPACKUNGSSTRUKTURE FUER HALBLEITERANORDNUNG UND VERFAHREN ZU DEREN HERSTELLUNG

A package structure in which a conductive layer is provided on the under side of a circuit board, a semiconductor device are mounted on the top side, and both airtightness and electromagnetic shielding capability are satisfied by the connection with conductive sealing parts through conductive throug...

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI, HIROYOSHI, IWAKI-SHI, FUKUSHIMA 979-01, JP, SATO, KAORI, IWAKI-SHI, FUKUSHIMA 970-04, JP, KONUMA, TAKAYUKI, IWAKI-SHI, FUKUSHIMA 972, JP, SHIKA, AKIRA, IWAKI-SHI, FUKUSHIMA 970-02, JP, YAMAMOTO, HIROYASU, IWAKI-SHI, FUKUSHIMA 972, JP, KATOUNO, MASANORI, IWAKI-SHI, FUKUSHIMA 979-01, JP
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A package structure in which a conductive layer is provided on the under side of a circuit board, a semiconductor device are mounted on the top side, and both airtightness and electromagnetic shielding capability are satisfied by the connection with conductive sealing parts through conductive through holes. With respect to the electrode structure for external connection, protruding parts of high temperature solder are formed for the adaption to the surface mounting.