KUPFERALUMINAT ENTHALTERDE PASTE AUF KUPFERBASIS FÜR MIKROSTRUKTURELLE UND SCHRUMPFUNGS-BEHERRSCHUNG VON KUPFERGEFÜLLTEN KONTAKTLÖCHERN

KUPFERALUMINAT ENTHALTERDE PASTE AUF KUPFERBASIS FÜR MIKROSTRUKTURELLE UND SCHRUMPFUNGS-BEHERRSCHUNG VON KUPFERGEFÜLLTEN KONTAKTLÖCHERN

A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the vi...

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Bibliographische Detailangaben
Hauptverfasser: DAVID, LAWRENCE, DANIEL, WAPPINGERS FALLS, NY 12590, US, MASTREANI, ANTHONY, HOPEWELL JUNCTION, NY 12533, US, VALLABHANENI, RAO, VENKATESWARA, WAPPINGERS FALLS, NY 12590, US, AOUDE, FARID, YOUSSIF, WAPPINGERS FALLS, NY 12590, US, DIVAKARUNI, RENUKA SHASTRI, RIDGEFIELD, CT 06877, US, FAROOQ, SHAJI, HOPEWELL JUNCTION, NY 12533, US, REDDY, SRINIVASA, S., N., LAGRANGEVILLE, NY 12540, US, HERRON, LESTER, WYNN, HOPEWELL JUNCTION, NY 12533, US, LASKY, HAL, MITCHELL, HYDE PARK, NY 12538, US, NATARAJAN, GOVINDARAJAN, PLEASANT VALLEY, NY 12569, US, WALL, DONALD RENE, WAPPINGERS FALLS, N.Y. 12590, US, SURA, VIVEK MADAN, PUNE - 411030, IN
Format: Patent
Sprache:ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.