Zuführapparat für chipartige elektronische Bauelemente

Chip-type electronic elements are applied in line on the surface of a carrier tape before they are supplied to an automatic electronic-element supply apparatus so as to be then automatically mounted on a printed circuit board. Side plates are disposed at an end portion of the body frame of the autom...

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Bibliographische Detailangaben
Hauptverfasser: NAKAMURA, HIDEKAZU, IBARAKI-SHI, JP, KADO, TAKAYOSHI, KATANO-SHI, JP, FUJIWARA, HIROYUKI, MINAMIKAWACHI-GUN, OSAKA-FU, JP, TERAZAWA, HIROAKI, FUKUSHIMA-KU, OSAKA-SHI, JP, FUJITA, TAKAYUKI, HIRAKATA-SHI, JP, TANAKA, KUNIO, KADOMA-SHI, JP, NEGISHI, SHIGETOSHI, SUITA-SHI, JP
Format: Patent
Sprache:ger
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Zusammenfassung:Chip-type electronic elements are applied in line on the surface of a carrier tape before they are supplied to an automatic electronic-element supply apparatus so as to be then automatically mounted on a printed circuit board. Side plates are disposed at an end portion of the body frame of the automatic electric element supply apparatus for a chip-type electronic element mounting apparatus in such a manner that a plurality of carrier tape reels can be fastened to the side plates and the carrier tapes are discharged from the tape reels in a ratchet manner while moving adjacently in parallel to one another through another end portion of the body frame. Thus, a multiplicity of kinds of electronic elements can be supplied from one supply apparatus.